Cte Ceramic Substrates

The coefficient of thermal expansion is defined as the fractional increase in the length per unit rise in temperature.

Cte ceramic substrates.

Kyocera is the global leading manufacturer of superior precision fine ceramics advanced ceramics. The coefficient of thermal expansion cte of the ceramic substrate is better matched to the cte of silicon compa red to substrates using a metal or a plastic basis. The optical response of the ceramics was measured in the spectral range 1 5ev to 4 5ev 826nm to 276nm using a spectroscopic ellipsometer 4 and in the spectral range 2 5μm to 25μm using a bio rad ft ir spectrometer for the se measurements the angle of incidence was 70 and measurement interval was 0 02ev. Alumina al 2 o 3 a473.

Standard packages and lids for device evaluation. Dilatometry and thermal expansion coefficient cte testing services. Logical clean air solution s substrates are extruded honeycomb monoliths containing thousands of parallel channels. Curamik ceramic substrates al2o3 24 w mk 20 c hps 26 w mk 20 c si3n4 90 w mk 20 c aln 170 w mk 20 c.

Cte ppm k rt 400 c thermal conductivity w mk flexural strength mpa young s modulus of elasticity gpa 1mhz. Curamik produces high temperature high voltage substrates in a master card format that measures 5 x 7 and 5 5 x 7 5. Learn about product material coefficient of thermal expansion. 1 520 789 6673 sign in or create an account.

Coefficient of linear thermal expansion cte with copper plating 5 to 60 higher dependent on copper thickness lower roughness on request rogers corporation. Choose professional dilatometry and thermal expansion coefficient cte testing services. In this interview azom talks to rohit ramnath senior product engineer from master bond about how to manage stresses caused by cte mismatches in adhesive applications. Shop our best selling single crystals wafers and substrates sputtering targets plus much more today.

Rogers corporation s curamik product suite offers best in class ceramic substrates that lead the industry in enabling power electronic printed circuits.